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Defect mitigation of electronic devices is conventionally achieved using thermal annealing. To mobilize the defects, very high temperatures are necessary. Since thermal diffusion is random in nature, the process may take a prolonged period of time. In contrast, we demonstrate a room temperature annealing technique that takes only a few seconds. The fundamental mechanism is defect mobilization by atomic scale mechanical force originating from very high current density but low duty cycle electrical pulses. The high-energy electrons lose their momentum upon collision with the defects, yet the low duty cycle suppresses any heat accumulation to keep the temperature ambient. For a 7 × 10⁵A cm⁻²pulsed current, we report an approximately 26% reduction in specific on-resistance, a 50% increase of the rectification ratio with a lower ideality factor, and reverse leakage current for as-fabricated vertical geometry GaN p–n diodes. We characterize the microscopic defect density of the devices before and after the room temperature processing to explain the improvement in the electrical characteristics. Raman analysis reveals an improvement in the crystallinity of the GaN layer and an approximately 40% relaxation of any post-fabrication residual strain compared to the as-received sample. Cross-sectional transmission electron microscopy (TEM) images and geometric phase analysis results of high-resolution TEM images further confirm the effectiveness of the proposed room temperature annealing technique to mitigate defects in the device. No detrimental effect, such as diffusion and/or segregation of elements, is observed as a result of applying a high-density pulsed current, as confirmed by energy dispersive x-ray spectroscopy mapping.

 

The characteristics of NiO/β-(Al0.21Ga0.79)2O3/Ga2O3 heterojunction lateral geometry rectifiers with the epitaxial layers grown by metal organic chemical vapor deposition were measured over a temperature range from 25 °C–225 °C. The forward current increased with temperature, while the on-state resistance decreased from 360 Ω.cm²at 25 °C to 30 Ω.cm²at 225 °C. The forward turn-on voltage was reduced from 4 V at 25 °C to 1.9 V at 225 °C. The reverse breakdown voltage at room temperature was ∼4.2 kV, with a temperature coefficient of −16.5 V K⁻¹. This negative temperature coefficient precludes avalanche being the breakdown mechanism and indicates that defects still dominate the reverse conduction characteristics. The corresponding power figures-of-merit were 0.27–0.49 MW.cm⁻². The maximum on/off ratios improved with temperature from 2105 at 25 °C to 3 × 107 at 225 °C when switching from 5 V forward to 0 V. The high temperature performance of the NiO/β-(Al0.21Ga0.79)2O3/Ga2O3 lateral rectifiers is promising if the current rate of optimization continues.

 

NiO/β-(Al x Ga 1− x ) 2 O 3 /Ga 2 O 3 heterojunction lateral geometry rectifiers with diameter 50–100  μm exhibited maximum reverse breakdown voltages >7 kV, showing the advantage of increasing the bandgap using the β-(Al x Ga 1− x ) 2 O 3 alloy. This Si-doped alloy layer was grown by metal organic chemical vapor deposition with an Al composition of ∼21%. On-state resistances were in the range of 50–2180 Ω cm 2 , leading to power figures-of-merit up to 0.72 MW cm −2 . The forward turn-on voltage was in the range of 2.3–2.5 V, with maximum on/off ratios >700 when switching from 5 V forward to reverse biases up to −100 V. Transmission line measurements showed the specific contact resistance was 0.12 Ω cm 2 . The breakdown voltage is among the highest reported for any lateral geometry Ga 2 O 3 -based rectifier.